High-Frequency Opto-electronic Packaging Engineer

reporting to the Director of Engineering

Background

OneChip Photonics is a venture-funded private company developing a new technology platform which combines indium-phosphide-based, photonic integrated circuits (PICs) and passive optical alignment. This technology has been used to demonstrate low-cost transceivers for the fiber-to-the-premise market and will expand to create new products to meet the rapidly growing demand for the increased communication-bandwidth requirements which are associated with transmission of video signals to smartphones and other personal communication devices.

Description of responsibilities

The candidate will have primary responsibility for the design, test and documentation of laser, detector and transceiver packages operating at frequencies greater than 10 GHz. This may include shielding, microstrip, stripline or other high-frequency trace optimization, as well as RF/microwave analog electronic circuit design and testing. Optical testing would also be required. The candidate would work with test engineers to specify and document test requirements for Manufacturing.

Experience/Education

The candidate should have experience in the development of packaging for commercial, high-speed opto-electronic devices, operating at 10 GHz or higher frequencies. Successful experience in transferring designs to high-volume manufacturing would be very desirable. Prior experience leading a development project would be valuable.

A BS in Electrical Engineering with 10 years experience in commercial product development, or an MS with at least 5 years experience is required.

Please submit your CV to careers@onechipphotonics.com to apply for this position. Only selected candidates will be contacted.

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